Manufacturing and process

Semiconductor

A fab runs hundreds of process steps on tools worth millions each. A day of downtime costs tens of millions, and the recipes are the crown jewels.

Fabs and foundriesEquipment makersOSATs
Talk to an advisor For product makers

How the process runs

From bare wafer to packaged chip

Wafers go through hundreds of steps of deposition, lithography, etch and implant, measured at every critical step, moved by overhead transport and fed by a sub-fab of ultra-pure water, gases and chemicals. Then they are tested, cut and packaged.

  1. Stage 1: Front-end processing

    Deposition, lithography, etch, implant and polishing build the chip layer by layer.

    Control systems
    Process tools and tool PCsEquipment automation (SECS/GEM)Recipe management
    Challenges1234

  2. Stage 2: Metrology and inspection

    Critical steps are measured, and the data drives process control.

    Control systems
    Metrology toolsFDC and APCYield management
    Challenges24

  3. Stage 3: Material handling

    Overhead transport moves wafer carriers between tools automatically.

    Control systems
    AMHSStockersMES dispatching

  4. Stage 4: Sub-fab and facilities

    Ultra-pure water, gases, chemicals, exhaust and cleanroom air support every tool.

    Control systems
    Facility monitoring (FMCS)Gas and chemical deliveryUPW control

  5. Stage 5: Wafer test

    Probers and testers check every die on the wafer.

    Control systems
    Probers and testersTest programs

  6. Stage 6: Assembly and final test

    Dies are cut, packaged and tested, often at an OSAT.

    Control systems
    Dicing and bonding toolsFinal testTraceability
Across every stage

Attackers rarely go straight for a controller. They travel through these shared systems, so this is where we look first.

MESTool vendor remote supportTool software updatesHost communication

For product makers

Building tools for fabs?

Fabs now ask equipment makers to prove a tool is secure before they accept it, starting with SEMI E187.

What makers build
  • Process tools
  • Metrology and inspection tools
  • Automated material handling
  • Sub-fab and facility equipment
  • Test and assembly equipment
What customers and regulators ask of the product
SEMI E187

Part of TSMC procurement contracts since 2023, checked before a new tool is introduced. Source: TSMC

SEMI E188 and E191

Fabs expect malware-free delivery, and tools that report their operating system and security status.

EU Cyber Resilience Act

Tools and software sold in the EU need CE marking under the CRA from 11 December 2027.

Where product makers start
Equipment OEM SecurityE187 tool hardeningEU CRA ComplianceGap to conformity assessmentIEC 62443-4-2 CSA CertificationThe features your product is missing

For plant owners

Where it gets hard, and how we tackle it

Our semiconductor vertical is built on SEMI E187, E188 and E191, for fabs, OSATs and equipment makers. Every answer protects yield and uptime first.

  1. 01 Front-end processing

    New tools can bring malware in

    In August 2018, a WannaCry variant spread through TSMC fabs after a new tool was connected without first being confirmed virus-free. TSMC expected it to cost about 3% of that quarter's revenue. Source: TSMC

    How we tackle it

    Malware-free intake built on SEMI E188: scanning, quarantine and acceptance checks for every tool, update and USB drive before it touches the fab network.

    Malware-Free Equipment Program
  2. 01 Front-end processing02 Metrology and inspection

    Tool PCs nobody can patch

    Tool PCs often run operating systems long out of support, and changing them means requalifying the process.

    How we tackle it

    We protect them without touching the process: segmentation, allow-listing, and E191 status reporting so the fab always knows each tool's operating system and security status.

    Fab Security & SEMI Compliance
  3. 01 Front-end processing

    Fabs now ask equipment makers for E187

    Since 2023, TSMC has made SEMI E187 part of its equipment procurement contracts, with checks before any new tool is introduced. Source: TSMC

    How we tackle it

    For equipment makers, we harden the tool to E187 and prepare the evidence fabs ask for at acceptance.

    Equipment OEM Security
  4. 01 Front-end processing02 Metrology and inspection

    Recipes are the crown jewels

    Process recipes and yield data hold years of R&D, and they move between tools, MES and engineers' laptops.

    How we tackle it

    We map where recipes live and travel, restrict and monitor access, and keep vendor support sessions away from them.

    Ecosystem Advisory

Where plant owners usually start

Three ways in

01Fab Security & SEMI ComplianceE187 / E188 / E191 roadmap02Equipment OEM SecurityE187 tool hardening03Malware-Free Equipment ProgramE188 intake · E191 status reporting

Rules and standards

What applies in semiconductor

  • SEMI E187Semiconductor industry

    Cybersecurity of fab equipment: supported operating system, network security, endpoint protection and security monitoring.

  • SEMI E188Semiconductor industry

    Malware-free equipment integration: checks before a tool or an update enters the fab.

  • SEMI E191Semiconductor industry

    Computing device cybersecurity status reporting: each tool reports its operating system and security status to the fab.

  • IEC 62443International

    Zones and conduits for fab networks, the sub-fab and facility systems.

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Operating in semiconductor?

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